New PDF release: Dielectric Films for Advanced Microelectronics (Wiley Series

By Mikhail Baklanov, Karen Maex, Martin Green

ISBN-10: 0470013605

ISBN-13: 9780470013601

ISBN-10: 0470065419

ISBN-13: 9780470065419

The subject of skinny motion pictures is a space of increasing importance in fabrics technological know-how, electric engineering and utilized good nation physics; with either examine and commercial purposes in microelectronics, machine production, and actual units. complicated, high-performance pcs, high-definition television, broadband imaging structures, flat-panel monitors, robot platforms, and clinical electronics and diagnostics are a couple of examples of the miniaturized equipment applied sciences that depend upon the usage of skinny movie materials.This booklet provides an in-depth evaluate of the unconventional advancements made through the clinical leaders within the quarter of recent dielectric movies for complicated microelectronic purposes. It contains transparent, concise causes of fabric technological know-how of dielectric movies and their challenge for gadget operation, together with high-k, low-k, medium-k dielectric movies and in addition particular positive factors and specifications for dielectric movies utilized in the packaging expertise. A extensive variety of similar themes are coated, from actual rules to layout, fabrication, characterization, and functions of novel dielectric motion pictures.

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Additional info for Dielectric Films for Advanced Microelectronics (Wiley Series in Materials for Electronic & Optoelectronic Applications)

Example text

The results described above indicated that the ‘stabilized’ FDLC still contained F atoms that were mobile in the structure at 400°C. Any residual fluorine that was released from the FDLC films in the Si/X/FDLC structures during the subsequent exposure at the high temperature was apparently able to escape from the FDLC film without causing significant damage to the bottom X/FDLC interface. However, the films deposited on top of FDLC in the Si/FDLC/X structures apparently prevented the escape of the fluorine released from FDLC.

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11] A. Grill, V. Patel, and C. Jahnes, J. , 145, 1649 (1998). [12] A. Grill, C. Jahnes, J. Ott, V. Patel, and S. Cohen, J. Hummel, R. Mih, and J. Liu, Electrochemical Society Proceedings, PV 98-3, 118 (1998). [13] Computer Graphics Services, CGS, Ithaca, NY. [14] n&k Analyzer 1280 from n&k Technology, Inc. 4051 Burton Drive, Santa Clara, California, 95054. [15] A. A. Neumayer, J. Appl. , 94, 6697 (2003). [16] A. Grill, V. Patel, and S. Cohen, Diamond and Related Materials, 3, 281 (1994). [17] A.

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Dielectric Films for Advanced Microelectronics (Wiley Series in Materials for Electronic & Optoelectronic Applications) by Mikhail Baklanov, Karen Maex, Martin Green

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