Download e-book for kindle: Handbook of Multilevel Metallization for Integrated Circuits by Syd R. Wilson, Clarence J. Tracy, John L. Freeman Jr.

By Syd R. Wilson, Clarence J. Tracy, John L. Freeman Jr.

ISBN-10: 0815513402

ISBN-13: 9780815513407

ISBN-10: 0815517610

ISBN-13: 9780815517610

This publication solutions a big want by means of pulling jointly in a single quantity an intensive technical precis of every of the main parts that make up a multilevel steel approach. incorporated are linked layout, research, fabrics, and production themes. It services as a very good studying device for the engineer newly assigned to paintings in metallization. It additionally serves as a reference textual content for any multi level marketing engineer, new or skilled, who needs to refresh their reminiscence. for somebody who desires to extra specialise in one topical quarter, an intensive directory of references has been supplied.

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Extra info for Handbook of Multilevel Metallization for Integrated Circuits - Materials, Technology, and Applications

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If the application is a high performance ASIC, where premium prices can be charged, the cost and manufacturability cannot be ignored, but often a more complex process must be used to achieve the required performance. e. manufacturability) be heavily considered since pricing is often the key differentiator. There is no case where reliability can be compromised. The basic decision process can be flow diagrammed as shown in Figure 3. The boxes in the flow diagram are discussed in the following. 1 Definition of the Target Technology The definition of the target technology requires obtaining inputs from a variety of other engineers.

When large currents are needed it must be decided whether to use one large contact / via or several small ones. Also if a blanket CVD metal plus etchback process is used, there must be a limit placed on the maximum contact / via dimension in at least one dimension. This is to ensure that the growth fronts meet in the center of the contact / via and close the seam in the feature. Otherwise, during the etchback the bottom of the feature will be etched away. Overlap of contacts / vias (d): The overlap is the amount on each side that the metal exceeds the contact / via dimension if the alignment is perfect.

16. 17. 18. 19. 20 21. 22. INTRODUCTION 23. 24. 25. 31 System,” Proc. IEEE VLSI Multilevel Interconnection Conf. (1989) p. 122. D. Weston, S . R. Wilson and M. Kottke, ‘‘Micrcxorrosionof Al-Cu and Al-Cu-Si Alloys: Interaction of the Metallization with Subsequent Aqueous Photolithographic Processing,” J. Vac. Sci. Technol. M,2025 (1990). Thomas E. Wade, “Proposed Comprehensive Test Vehicle for Monitoring Multilevel Interconnection Process Variabilities, Misalignment, Parametria and Defect Density,” Proc.

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Handbook of Multilevel Metallization for Integrated Circuits - Materials, Technology, and Applications by Syd R. Wilson, Clarence J. Tracy, John L. Freeman Jr.

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