Download e-book for iPad: Lead-Free Soldering in Electronics: Science, Technology, and by Katsuaki Suganuma

By Katsuaki Suganuma

ISBN-10: 0824741021

ISBN-13: 9780824741020

ISBN-10: 0824758595

ISBN-13: 9780824758592

Assessing the clinical and technological features of lead-free soldering, Lead-Free Soldering in Electronics considers the mandatory heritage and specifications for correct alloy choice. It highlights the metallurgical and mechanical homes; plating and processing applied sciences; and review tools important to the construction of lead-free solders in electronics.A priceless source for these attracted to selling environmentally-conscious digital packaging practices!Responding to expanding environmental and health and wellbeing matters over lead toxicity, Lead-Free Soldering in Electronics discusses:Soldering inspection and designMechanical evaluate in electronics Lead-free solder paste and reflow solderingWave solderingPlating lead-free soldering in electronicsLead-Free Soldering in Electronics will gain production, electronics, and mechanical engineers, in addition to undergraduate and graduate scholars in those disciplines.

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Extra resources for Lead-Free Soldering in Electronics: Science, Technology, and Environmental Impact

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015 cm/sec. 2 lb for the SOIC device leads. 3 kg. The maximum load values for SOIC device leads as shown in Fig. 18 are characteristic of the measurements for all three device types as a function of circuit board surface finish. 40 Handwerker et al. 17 (a) Yield stress as a function of composition and temperature from IDEALS Lead-Free Project. (b) Yield stress as a function of composition and homologous temperature for Sn–40Pb and four lead-free solder alloys. 18 Pull strength of SOIC leads as a function of solder composition and surface finish.

2Ag (138jC), and Sn– In (120jC). The NCMS Lead-Free Project member companies selected solders with liquidus temperatures less than 225jC and with a pasty range (the difference between liquidus and solidus temperatures) to less than 30jC. The IDEALS and NEMI projects limited its candidate solders to eutectic and near eutectic, Sn-rich solders. For Sn-rich solders, a simple linear equation can be used to estimate the change in liquidus temperature with composition for additions of Ag, Bi, Cu, Ga, In, Pb, Sb, and Zn to Sn [1].

Production equipment and the entire basis of assembly design has been optimized for the use of Sn–Pb eutectic over the last 30 years and it is therefore important to consider to what stage lead-free implementation within a process has been achieved. An alloy selected for use with older style production equipment where good temperature control may be problematic, and, where some possibility of Pb contamination exists, may not be the optimum choice, even for an identical assembly, if the process has been initially designed to utilize energy-saving lead-free compatible production equipment, suitable components and other materials.

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Lead-Free Soldering in Electronics: Science, Technology, and Environmental Impact by Katsuaki Suganuma

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